Artificial Intelligence in Semi-Conductor Chips
DOI:
https://doi.org/10.47392/IRJAEM.2026.0127Keywords:
AI Accelerators, Neuromorphic Computing, GAAFET, 3D IC Packaging, Edge AI, RISC-VAbstract
By 2026, the global semiconductor scene looks pretty different, instead of everyone relying on giant GPU clusters, the industry has moved toward distributed, specialized AI accelerators. Here, we dig into how neuromorphic computing and 3D-stacked Gate-All-Around (GAAFET) transistors come together to break through the old “Power Wall” that held back AI processing. Our framework for on-chip adaptive learning cuts data center dependence by 40 percent a big shift. What stands out is this: combining RISC-V architectures with spiking neural networks (SNNs) delivers the speed you need for real-time, agentic AI.
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Copyright (c) 2026 International Research Journal on Advanced Engineering and Management (IRJAEM)

This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.
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